24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]
There are thousands of PCB manufacturers and PCB assembly factories in China, why should I choose Hitech? Good Pricing We have 2 factories by far, and each one is dedicated in one aspect of PCB production, the workers are more professional and skillful in specified area, then the efficiency is higher and the cost is lower; also, our inland factory employs cheaper labor forces and housing than Shenzhen area, so the cost is cheaper obviously. Quick Delivery Devilry is quick–5-8 working days normally, 2 working days with a premium. High quality We fully understand quality comes first. All our factories [...]
High Density Interconnects pcb (HDI pcb) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market
segments. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit
They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.
Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control