Capability

Rigid PCB Capabilities

Hitechpcb is continuously innovating the technology improving our rigid PCB Capability to meet customers High-Tech requirements with High-Density PCB, High Multilayer pcb, Greater Aspect Ratio, betterImpedance Controlled product.

Our Rigid PCB Capabilities below:

Layer counts: 1-38 Layers
Maximum size: 580x1900mm
Material: CEM1, FR1,FR-4,High Tg FR-4,Halogen free,High Frequency(Rogers,Arlon,Taconic,Nelco…), Aluminium base, Copper base
Board outline tolerance: ±0.10mm
Board thickness: 0.1-6.0mm
Thickness tolerance: ( t ≥0.8mm) ±8%
Thickness tolerance: ( t <0.8mm) ±10%
Out layer copper thickness : H oz -20 oz
Inner layer copper thickness: 1/2 oz -10oz
Minimum line/ space: 0.075mm
Minimum finished hole: (mechanical) 0.15mm
Minimum finished hole: (laser) 0.1mm
Aspect ratio:15:1
Impedance control tolerance: ±10%
Bow and twist: Max. 0.7%
HDI PCB stack up: 1+N+1,2+N+2,1+1+N+1+1,3+N+3
Surface Treatment: HASL,HASL Lead Free, ENIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Carbon Ink, Peelable Mask.
Microvia & ELIC technology

Flexible PCB Capability

Hitechpcb is professional Flexible PCB Manufacturer, we can produce flexible printed circuit board, rigid-flex multilayer PCB up to 12 Layers, Flex-rigid PCB line width / spacing can be achieved minimum 3mil, we also provide Rigid-Flex Circuit Boards with HDI PCB, Impedance Control board.

Layer counts 1-12 layers
Base material Kapton, PI, PET (Flex)/FR4 (Rigid)
Base material thickness 12.5um-50um(Flex)/0.1mm to 3.2mm(Rigid)
Copper thickness 1/2 oz to 2 oz
Protective film thickness 12um to 25um
Adhesive thickness 12um to 35um
Reinforcement PI, PET, FR4, Stainless steel
Maximum board size 9.842”*19.685”
Minimum Line/ Space .002”
Minimum hold .006”
Surface Treatment: ENIG,Immersion Tin,OSP,Carbon Ink.

Metal Core PCB Capability

Layers:1-4 Layers
Metal core board type: Normal Aluminum pcb, COB MCPCB, Copper base board,
Max Dimension:1900mm*480mm
Min Dimension:5mm*5mm
Min Trace& line spacing:0.1mm
Warp & Twist:<0.5mm
Finished Product Thickness:0.2-4.5 mm
Copper Thickness:18-240 um
Hole Inner Copper Thickness:18-40 um
Hole Position Tolerance:+/-0.075 mm
Min Punching Hole Diameter:1.0mm
Min Punching Square Slot Specification::0.8mm*0.8mm
Silk Prints Circuit Tolerance:+/-0.075 mm
Outline Tolerance:CNC:+/-0.1mm; Mould:+/- 0.75mm
Min Hole Size:0.2 mm (No limitation in Max hole dimention)
V-CUT Angle Deviation:+/-0.5°
V-CUT Board Thickness Range:0.6mm-3.2mm
Min Component Mark Character Style:0.15 mm
Min Open Window for PADs:0.01mm
Solder Mask:Green, White, Blue, Matte black, Red.
Surface Finishing:HASL, HASL LF, Immersion Gold, OSP

Ceramic PCB capability

AL203 Ceramic Capability

AL203 ceramic (thickness in more than 2.0mm, need to be customized)
0.25mm 114*114mm
0.38mm 130*140mm
0.5mm 130*140mm
0.635mm 130*140mm
0.8mm 130*109mm
1.0mm 130*140mm
1.2mm 130*109mm
1.5mm 127*127mm
2.0mm 130*140mm
Above is regular size,and other sizes can be customized, the maximum size we can do is 300*300mm

ALN Ceramic Capability

ALN Ceramic (thickness in above 1.0mm, need to be customized)
0.25mm 50.8*50.8mm
0.38mm 114*114mm
0.5mm 114*114mm
0.635mm 114*114mm
1.0mm 300*300mm
Thermal Conductivity AL203 Ceramic AL2O3:20~51(W/mK)
ALN Ceramic AIN:120~220(W/mK)
Finished Copper Thickness Copper thickness 18/35/70um
Hole Hole size 0.075mm-30mm
Surface Finish ROHS Immersion Silver, ENIG, ENEPIG
Conductor Characteristic Copper – Cu
Min. Line width and spacing Inner layers: 50um/50um (Request base copper less than 10um )
External layers 50um/50um (Request base copper less than 10um )
Profiling Maximum Board Dimension 300*300mm/pcs

PCBA Capability

SMT production capacity: 4 SMT Lines(6 million chips per day (0402, 0201 with 6 million per day)
DIP production capacity: 3 Production Lines(1.6 million pcs per day)
Fine pitch assembly down to 01005, 0201 size
High accuracy placement-down to 4mil(0.1mm) pitch devices
Single or double-sided placement
Cable & Harness Assembly
Box Build Assembly
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achievable. Stencils can be cut and delivered inside of 4 hours.
Delivery Time:
PCBA Prototype: 1-3 days,
Medium Volume: 4-10 days,
Mass Production: Depends on BOM

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