Rigid PCB Capabilities

Hitechpcb is continuously innovating the technology improving our rigid PCB, Flexible PCB, Aluminium PCB, Ceramic PCB and PCB Assembly Capability to meet customers High-Tech requirements with high quality and low cost.

Our Rigid PCB Capabilities below:

Layer counts: 1-38 Layers
Maximum size: 580x1900mm
Material: CEM1, FR1,FR-4,High Tg FR-4,Halogen free,High Frequency(Rogers,Arlon,Taconic,Nelco…), Aluminium base, Copper base
Board outline tolerance: ±0.10mm
Board thickness: 0.1-6.0mm
Thickness tolerance: ( t ≥0.8mm) ±8%
Thickness tolerance: ( t <0.8mm) ±10%
Out layer copper thickness : H oz -20 oz
Inner layer copper thickness: 1/2 oz -10oz
Minimum line/ space: 0.075mm
Minimum finished hole: (mechanical) 0.15mm
Minimum finished hole: (laser) 0.1mm
Aspect ratio:15:1
Impedance control tolerance: ±10%
Bow and twist: Max. 0.7%
HDI PCB stack up: 1+N+1,2+N+2,1+1+N+1+1,3+N+3
Surface Treatment: HASL,HASL Lead Free, ENIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Carbon Ink, Peelable Mask.
Microvia & ELIC technology

Flexible PCB Capability

Hitechpcb is professional Flexible PCB Manufacturer, we can produce flexible printed circuit board, rigid-flex multilayer PCB up to 12 Layers, Flex-rigid PCB line width / spacing can be achieved minimum 3mil, we also provide Rigid-Flex Circuit Boards with HDI PCB, Impedance Control board.

Layer counts 1-12 layers
Base material Kapton, PI, PET (Flex)/FR4 (Rigid)
Base material thickness 12.5um-50um(Flex)/0.1mm to 3.2mm(Rigid)
Copper thickness 1/2 oz to 2 oz
Protective film thickness 12um to 25um
Adhesive thickness 12um to 35um
Reinforcement PI, PET, FR4, Stainless steel
Maximum board size 9.842”*19.685”
Minimum Line/ Space .002”
Minimum hold .006”
Surface Treatment: ENIG,Immersion Tin,OSP,Carbon Ink.

Metal Core PCB Capability

Layers:1-4 Layers
Metal core board type: Normal Aluminum pcb, COB MCPCB, Copper base board,
Max Dimension:1900mm*480mm
Min Dimension:5mm*5mm
Min Trace& line spacing:0.1mm
Warp & Twist:<0.5mm
Finished Product Thickness:0.2-4.5 mm
Copper Thickness:18-240 um
Hole Inner Copper Thickness:18-40 um
Hole Position Tolerance:+/-0.075 mm
Min Punching Hole Diameter:1.0mm
Min Punching Square Slot Specification::0.8mm*0.8mm
Silk Prints Circuit Tolerance:+/-0.075 mm
Outline Tolerance:CNC:+/-0.1mm; Mould:+/- 0.75mm
Min Hole Size:0.2 mm (No limitation in Max hole dimention)
V-CUT Angle Deviation:+/-0.5°
V-CUT Board Thickness Range:0.6mm-3.2mm
Min Component Mark Character Style:0.15 mm
Min Open Window for PADs:0.01mm
Solder Mask:Green, White, Blue, Matte black, Red.
Surface Finishing:HASL, HASL LF, Immersion Gold, OSP

Ceramic PCB capability

AL203 Ceramic Capability

AL203 ceramic (thickness in more than 2.0mm, need to be customized)
0.25mm 114*114mm
0.38mm 130*140mm
0.5mm 130*140mm
0.635mm 130*140mm
0.8mm 130*109mm
1.0mm 130*140mm
1.2mm 130*109mm
1.5mm 127*127mm
2.0mm 130*140mm
Above is regular size,and other sizes can be customized, the maximum size we can do is 300*300mm

ALN Ceramic Capability

ALN Ceramic (thickness in above 1.0mm, need to be customized)
0.25mm 50.8*50.8mm
0.38mm 114*114mm
0.5mm 114*114mm
0.635mm 114*114mm
1.0mm 300*300mm
Thermal Conductivity AL203 Ceramic AL2O3:20~51(W/mK)
ALN Ceramic AIN:120~220(W/mK)
Finished Copper Thickness Copper thickness 18/35/70um
Hole Hole size 0.075mm-30mm
Surface Finish ROHS Immersion Silver, ENIG, ENEPIG
Conductor Characteristic Copper – Cu
Min. Line width and spacing Inner layers: 50um/50um (Request base copper less than 10um )
External layers 50um/50um (Request base copper less than 10um )
Profiling Maximum Board Dimension 300*300mm/pcs

Ceramic PCB Parameter

Ceramic PCB in high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, then Ceramic PCB will be your best choice.

Why Ceramic PCB has such excellent performance?

96% or 98% Alumina (Al2O3), Aluminum Nitride (ALN), or Beryllium Oxide (BeO)
Conductors material: For thin film technology, thick film technology, it’ll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it’ll be copper only
Application temp: -55~850C
Thermal conductivity value: 16W~28W/m-K (Al2O3); 150W~240W/m-K for ALN , 220~250W/m-K for BeO;
Max compression strength: >7,000 N/cm2
Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)

PCBA Capability

SMT production capacity: 4 SMT Lines(6 million chips per day (0402, 0201 with 6 million per day)
DIP production capacity: 3 Production Lines(1.6 million pcs per day)
Fine pitch assembly down to 01005, 0201 size
High accuracy placement-down to 4mil(0.1mm) pitch devices
Single or double-sided placement
Cable & Harness Assembly
Box Build Assembly
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achievable. Stencils can be cut and delivered inside of 4 hours.
Delivery Time:
PCBA Prototype: 1-3 days,
Medium Volume: 4-10 days,
Mass Production: Depends on BOM

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