Technical description high power 5730 LED square mirror-cob-aluminum-pcb with driver Product type: Aluminum Substrate Material: Aluminum plate +high thermal insulation material Layer/Thickness: 1L/1.6 mm Outer Copper:/ 1.5 OZ Surface treatment: HASL LF Min Line Width: ≥ 0.3mm Min Line Space: ≥0.25mm Min Hole: ≥3 mm Solder Mask: White X 1 side Technical featuer: special materials Application: Lamps and lanterns
Technical description Layers: 2Rigid + 2flex + 2Rigid design Material: FR4 middle TG + Dupont AP8515R Thickness: Rigid 0.80mm Flex 0.20mm with stiffener Surface treatment: immersion gold Apply for surveillance producation Solder mask: Green + Coverlay Legend: White Rigid-flex Printed circuit board manufacturer from China
Technical description Minit_OnePhase Big board 6 layers Heavy copper printed wiring board Material: FR4 Tg170 Thickness: 2.8mm Panel size: 341*195mm Surface finished: Immersion Gold Copper thickness: 1.5/4/4/4/4/1.5 Oz Blue LPI solder mask White legend mark For power products
Technical description 4Layer Rigid PCB material: FR4 Tg170 Finish thickness: 1.6mm Copper thickness: 1/1/1/1 Oz Minimum width/spacing: 0.15/0.15mm Minimum via diameter: 0.30mm Surface finish: HASL LF Solder mask: Green Legend: White OEM generation material
10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170（Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark
Technical description H oz copper thickness Stiffener: PI Surface finish: Immersion Ni/Au Min. trace width/spacing: 0.10/0.10mm Min. hole: 0.25mm
Technical description POLYIMIDE material color black H oz copper thickness Stiffener: PI Surface finish: ENIG Min. trace width/spacing: 0.15/0.15mm Profiling: Lasering cutting
Technical description POLYIMIDE material H oz copper thickness Stiffener: PI Surface finish: OSP Min. trace width/spacing: 0.10/0.10mm Number of bend cycles 100000
Technical description POLYIMIDE material H oz copper thickness Stiffener: PI Surface finish: ENIG Min. trace width/spacing: 0.10/0.10mm Laser cutting
Technical description KAPTON material H oz copper thickness Stiffener: PI Surface finish: ENIG Min. trace width/spacing: 0.10/0.10mm Punching