- 10L High Density Interconnect PCB
- Laminate: FR4, Tg150
- Board thickness: 1.6mm
- Copper thickness: 17.5um (Hoz) for all layers
- Solder resist: green color
- Surface Finish: Immersion gold
- Trace width/width: 0.89/0.1mm
- Min. holes:0.1mm
- Controlled Impedance
- Board stack up: 1+1+6+1+1
- Application: Industry control
What is HDI PCB?
High-Density Interconnect (HDI PCB) is simply a PCB with more number of interconnections, occupying minimal space. This results in the miniaturization of the circuit board. The components are placed closer and the board space is significantly reduced but the functionality isn’t compromised.
To be more precise, a PCB with an average of 120 to 150 pins per square inch is considered as an HDI PCB. The HDI design incorporates dense component placement and versatile routing. The HDI PCB popularized microvia technology. A denser circuitry is crafted with the implementation of microvias, buried vias, and blind vias. The drill to copper is reduced in an HDI design.
HDI pcb VS standard FR4 PCBs
HDI PCB provides a better signal integrity performance than non-HDI because all the stray capacitances and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher, which causes a greater discontinuity in impedance than a microvia does. Some of the significant differences between the High density PCB and standard PCBs are listed below:
High density PCB:
More components on surface of board
Smaller, thinner, more functionality
With Blind, buried and Microvias holes
Standard FR4 PCB
Large size of boards
If you want to learn more knowledge of HDI PCB, or you need know the stack up for different layers HDI board, please email to us.