Project Description

High density pcb 10 layers

10 layers high density interconnect PCB board made of FR-4, Tg 150 with immersion gold surface treatment.

High-Density Interconnect (HDI)  PCB is simply a PCB with more number of interconnections and buried hole, blind hole, occupying minimal space. This results in the miniaturization of the circuit board. The components are placed closer and the board space is significantly reduced but the functionality isn’t compromised.

Technical Parameters

  • 10L High Density Interconnect PCB
  • Laminate: FR4, Tg150
  • Board thickness: 1.6mm
  • Copper thickness: 17.5um (Hoz) for all layers
  • Solder resist: green color
  • Surface Finish: Immersion gold
  • Trace width/width: 0.89/0.1mm
  • Min. holes:0.1mm
  • Controlled Impedance
  • Board stack up: 1+1+6+1+1
  • Application: Industry control

What is HDI PCB?

High-Density Interconnect (HDI PCB) is simply a PCB with more number of interconnections, occupying minimal space. This results in the miniaturization of the circuit board. The components are placed closer and the board space is significantly reduced but the functionality isn’t compromised.

To be more precise, a PCB with an average of 120 to 150 pins per square inch is considered as an HDI PCB. The HDI design incorporates dense component placement and versatile routing. The HDI PCB popularized microvia technology. A denser circuitry is crafted with the implementation of microvias, buried vias, and blind vias. The drill to copper is reduced in an HDI design.

HDI pcb VS standard FR4 PCBs

HDI PCB provides a better signal integrity performance than non-HDI because all the stray capacitances and inductances ge