Technical description

  • Product type:SMT PCB Assembly Supplier
  • Material: FR4 High TG
  • Layer/Thickness:4L/1.8mm
  • Outer Copper: 2 OZ
  • Surface treatment: ENIG
  • Min Line Width: ≥ 0.13mm
  • Min Line Space: ≥0.15mm
  • Min Hole: ≥0.15 mm
  • Solder Mask: green
  • Silkscreen: white
  • Technical featuer: special line
  • Application: high frequency communication