SMT production capacity: 4 SMT Lines(6 million chips per day (0402, 0201 with 6 million per day)
DIP production capacity: 3 Production Lines(1.6 million pcs per day)
Fine pitch assembly down to 01005, 0201 size
High accuracy placement-down to 4mil(0.1mm) pitch devices
Single or double-sided placement
Cable & Harness Assembly
Box Build Assembly
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achievable. Stencils can be cut and delivered inside of 4 hours.
PCBA Prototype: 1-3 days
Medium Volume: 4-10 days
Mass Production: Depends on BOM