Technical description

  • 8layers High density PCB (HDI PCB) for cell phone
  • Base material: FR4, Tg150
  • Layer count: 8 layers (HDI PCB)
  • Surface finishing: immersion gold
  • Board thickness: 1.0mm
  • Copper thickness: 0.5oz
  • Minimum line width: 0.075mm
  • Minimum line spacing: 0.075mm
  • Laser drilling + blind and