Technical description
- 8layers High density PCB (HDI PCB) for cell phone
- Base material: FR4, Tg150
- Layer count: 8 layers (HDI PCB)
- Surface finishing: immersion gold
- Board thickness: 1.0mm
- Copper thickness: 0.5oz
- Minimum line width: 0.075mm
- Minimum line spacing: 0.075mm
- Laser drilling + blind and
