Project Description
10 layer high density printed circuit board
10 layers high density printed circuit board composed of FR4, Tg170 with immersion gold surface finishing, by using microvias technology to improve assembly and space utilization. HDI pcb is a platform that provides component connection, which is used to undertake the basis of connecting parts.
Technical Parameters
- 10layers HDI PCB
- Base material: FR4, Tg170
- Surface finishing: immersion gold
- Board thickness: 1.0mm
- Copper thickness: 0.5oz
- Minimum line width: 0.1mm
- Minimum line spacing: 0.1mm
- Laser drilling + blind and buried drilling Impedance control
- Board stack up: 1+8+1
- Impedance control
