Technical description
- 10layers HDI PCB
- Base material: FR4, Tg170
- Surface finishing: immersion gold
- Board thickness: 1.0mm
- Copper thickness: 0.5oz
- Minimum line width: 0.1mm
- Minimum line spacing: 0.1mm
- Laser drilling + blind and buried drilling Impedance control
- Board stack up: 1+8+1
- Impedance control
