The HDI PCB board is thin and small, and can realize high-density interconnection PCB board.
HDI PCB stands for High Density Interconnect PCB. HDI board is the Japanese enterprise to the high density interconnection printed circuit board has always been called, and in Europe and The United States will be called HDI board “micro hole board”. HDI is a kind of PCB technology. It is a method evolved to make high precision circuit board with the development of electronic technology. It can realize high density wiring and is generally manufactured by stacking method. HDI takes conventional multilayer board as core board, and then layer by layer superposition insulation and line layer (also known as ” accumulation layer “), and uses laser drilling technology for layer drilling conduction, so that the whole printed circuit board has formed a layer connection with buried, blind hole as the main conduction mode.
Compared to PCB, HDI PCB board production process requirements are higher:
HDI can be divided into the following three categories according to the actual difficulty of basic HDI PCB manufacturing, market scale and development trend:
(1) Entry Level : First-order (1+C+1), second-order (2+C+2), third-order (3+C+3)
(2) General class: Any layer(n+C+n, mostly 10-12 layer.)
(3) High-end class: SLP, rigid flexible PCB board(rigid board area using HDI technology)
The advantages of HDI PCB are light, thin, short and small, which can increase the circuit density, facilitate the use of advanced packaging technology, improve the signal output quality greatly, greatly improve the function and performance of electronic and electrical products, and make electronic products more compact and convenient in appearance. For higher-order communications products, HDI PCB technology can help improve signal integrity, facilitate strict impedance control and improve product performance.
According to Prismark report, HDI output was $9.222 billion in 2018. Affected by the weakness of the downstream mobile phone market, the output value only increased by 2.8% year-on-year in 2017, while the total output value of PCB market increased by 6.0% year-on-year. The annual growth rate of HDI output is expected to remain at about 2.9% from 2018 to 2023.
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