Multi-layer printed circuit board | Hitech Circuits Co., Ltd.

Multi-layer printed circuit board assembly-Hitech Circuits Co., Limited

High Speed PCB Design

Hitechcircuits’ experts work closely with customers to provide consulting and guidance for EMC and SI design throughout the PCB design process in the following areas: System-Level Architecture and floor-planning, main boards, daughterboards, backplanes, connectors, cables, grounding. Enclosure design and shielding, installation practice. Schematic Review High-speed signals, differential signaling, I/O interfaces (digital/analog, telecom and local-area network), magnetics, filters, connectors, power supply filtering and board decoupling/bypassing. PCB Design Stackup selection and layer assignment, partitioning, routing high-speed and other critical nets, termination, noise-coupling mechanisms and prevention, common-mode suppression, I/O and filtering, high-voltage clearances, power-supply, decoupling and bypassing, power and ground [...]

Andy Liu2021-03-13T11:10:43+00:00Categories: Blog|Tags: board design, electronic board design, Multi-layer printed circuit board, PCB design|

Panasonic Megtron6 multilayer PCB–High Speed, Low Loss Multi-layer Materials

Panasonic Megtron6 multilayer PCB--High Speed, Low Loss Multi-layer Materials MEGTRON 6 is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON 6 are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410°C (770°F). MEGTRON 6 meets IPC specification 4101 /102 /91.

Andy Liu2020-06-03T18:24:03+00:00Categories: Multilayer Printed Circuit Board, PCB Products|Tags: high speed PCB, Multi-layer printed circuit board, Panasonic Megtron6 multilayer PCB|

The difference between Core and Prepreg

The Prepreg is an insulating material for the PCB. Prepreg is not prepreg before being laminated, also known as prepreg,prior to lamination, and is primarily used as a bonding material and an insulating material for the inner conductive pattern of a multilayer printed circuit board. After the Prepreg is laminated, the semi-cured epoxy is extruded, begins to flow and solidifies, bonds the multilayer sheets together and forms a reliable insulator. The Core is the basic material for making printed circuit boards. The Core is also known as the core board, which has a certain hardness and thickness, as well [...]

Andy Liu2019-11-16T10:24:36+00:00Categories: Blog|Tags: circuit board assembly, High density Printed circuit board, Multi-layer printed circuit board, pcb fabrication and assembly, Rigid-flex PCB.|

Organizational Structure

Over the years we have been insisting technological innovation, excellence, so that people well-know Hitech Circuits Co., Limited – "Specializes in High Multi-layer printed circuit board, High Density Interconnection PCB, Aluminium metal core PCB, Quick turn pcb assembly service, Special Materials and Special Process Printed Circuit Boards.". Today's Hitech Circuits Co.,Limited already has two branch factories: one is a Quick Turn PCB Prototype Factory, So it's all about we have a good management and good organizational structure inseparable. Our organization:

admin2019-09-07T17:21:10+00:00Categories: About Us|Tags: board assembly, electronic board assembly, High Density Interconnection PCB, Multi-layer printed circuit board, PCB Assembly, Quick turn pcb|

Why are Rigid Flex PCBs ( Flexible-rigid PCB ) Economical?

There are several great advantages of using rigid-flex PCBs, not just from a technical standpoint, but also from a cost-saving point of view. Ability to Merge Designs With rigid-flex printed circuit boards, you are able to merge multiple PCBs into one design as only one design is needed for a rigid-flex. Usually, with rigid PCBs, multiple designs and cable assemblies are required for the production. As such, rigid-flex circuit boards can be more expensive to manufacture as they may require multiple designs and cable assemblies to facilitate the production. Reduced Space Requirements As rigid-flex PCBs utilise thin and [...]

Andy Liu2020-02-13T23:13:48+00:00Categories: Blog|Tags: fast pcb assembly, flexible circuit capability, Multi-layer printed circuit board, rigid flex pcb, Rigid Multilayer PCB, Rigid-flex PCB.|

The Importance of PCB Testing

Why Should I Test PCBs? The testing phase of PCB manufacturing is one of the most important stages. Without testing your PCBs, there may be errors and problems that have been overlooked during the production stage. These problems may eventually cause failures and defects in the field. In order to reduce the chance of failure and maintain customer satisfaction, it’s important that testing procedures are implemented to ensure that the printed circuit board and the components are fully functioning. Having testing procedures throughout the production phase allows you to identify errors and issues earlier on, rather than at the final [...]

Andy Liu2019-04-04T16:27:01+00:00Categories: Blog|Tags: electronic board assembly, HDI rigid flex pcb, Multi-layer printed circuit board, PCB quality, printed circuit Board Assembly, smt pcb assembly|

Soldering Processes for Printed Circuit Boards – Preparation and Component Removal

Printed Circuits Boards (PCBs) have become an essential product for many industrial applications. They do not take up much space in an application, nor do they add immense weight to the application product. They minimize electric noise in the product, and are easy to maintain and repair. In this post, we shall be discussing the PCB soldering process. Pre-soldering Procedures As there are a variety of procedures within soldering, we shall be focusing on soldering preparation and component removal phases. General purpose cleaner Desolder tool Soldering iron, solder, flux Desolder Braid Microscope Wipes Choose the Right Soldering [...]

Andy Liu2020-02-13T23:05:24+00:00Categories: Blog|Tags: electronic pcb assembly, Flex printed circuit board, High density Printed circuit board, Multi-layer printed circuit board, Quick turn PCBA prototype|

PCB Manufacturing and PCBA electronics assembly Treds

PCB Manufacturing and PCBA electronics assembly Treds With new and improved technologies, the field of Printed Circuit Board (PCB) manufacturing has been constantly evolving. The electronics industry is driven by innovations and better manufacturing methods that are growing in popularity. Improved technologies also demand the manufacturers to pay attention to the cost factors as well. With the existing technologies getting obsolete, it is important for manufacturers to keep up with the latest trends and developments. Let us get you through some of the most important developments in the PCB manufacturing industry, in the recent times. PCB Manufacturing Trends and [...]

Andy Liu2020-02-13T23:03:20+00:00Categories: Blog, Industry News|Tags: board assembly, Flex printed circuit board, Multi-layer printed circuit board, Multilayer pcb︱quick turn pcb︱pcb manufacturing, PCB assembly manufacturer, printed circuit Board Assembly|

PCB Manufacturing and PCB Assembly Step-by-Step Guide for Electronic Assembly process

Printed Circuit Board or PCB’s are an integral part of every electronic device. They are the green chips that you can find within all electronic devices. These green chips or Printed Circuit Boards are printed with copper lines called traces, which carry signals to various components. This systematic transmission of signals ensures the proper functioning of the electronic device. PCBs are omnipresent in every modern day electronic device. As the technology advances and the electronic devices becoming more and more compact, there is a drastic reduction in the size of the PCB. This reduction in size increases the complexity of [...]

Andy Liu2020-02-13T23:00:31+00:00Categories: Blog, Industry News|Tags: board assembly, Electronic assembly, Flex printed circuit board, High Density Interconnection PCB, Multi-layer printed circuit board, PCB Assembly, PCB assembly manufacturer|

Why No Part Subs is a Bad Idea- components substitutions-HitechPCB

Across all industries, component shortages are forcing design engineers to seek alternative parts and materials, or entirely redesign their projects.With analysts predicting the shortages to last potentially through 2018, the market is scrambling to find ways to keep projects on-time and on-budget. One common practice currently compounding the challenge of limited supply is a refusal to accept part substitutions. When designing a new board or revising an existing project, engineers tend use familiar parts. This reduces risk of the board not working and makes it easier to put together the necessary files including a Bill of Material (BOM). To [...]

Andy Liu2020-06-03T23:11:38+00:00Categories: Blog|Tags: circuit board assembly, electronic board assembly, Multi-layer printed circuit board, PCB Assembly, printed circuit Board Assembly|