board design

/Tag: board design

LED aluminum PCB design

LED Aluminum PCB is composed of the circuit layer (copper foil layer), thermal insulation layer and the metal core layer. Circuit layer require great current-carrying capacity, thus should use thicker copper foil and generally the thickness is from 35um to 280um; Thermal insulation layer is the core technology of aluminum PCB, it is usually made up of special ceramics and fill special polymers, with small thermal resistance, good viscoelasticity, and has thermal aging ability, and can be able to withstand mechanical and thermal stress. Thermal insulation layer of IMS-H01、IMS-H02 and LED-0601 and other high-performance aluminum PCB are using this technology, [...]

How to prevent warp on printed circuit boards?

The bow and twist issue on Printed Circuit Board can cause components and parts registration in PCB assembly process, when handling with SMT or THT, if the component pins are positioning not trim, which will bring a lot of difficulties on assembly and installation. IPC-6012 standard define the maximum bow and twist 0.75% on circuit boards of SMB—SMT, other PCB bow and twist is generally not exceed 1.5%; Electronic assembly plants allow bow and twist (double/multilayer PCB) is usually 0.70---0.75%. As a matter of fact, many rigid PCB boards (board thickness 1.6 mm) require bow and twist is less than [...]

Tips of high frequency PCB (RF PCB) design

In order to achieve more reasonable design and better anti-interference ability for high frequency PCB(Microwave RF PCB), design engineer should consider the tips as following: Use inner layer as power ground layer, which will have the effect of shielding and even decreasing spurious inductance, shorten length of signal wire, reducing Cross interference between signals. Circuit layout must be turn with 45 degree angle, which will help to reduce high frequency signal emission and coupling between each other. The shorter the better for length of circuit layout. The less the better for through holes. Layout between layers should be in vertical [...]

Successful Flex Circuit Design Guidelines

With the use of sensors and technology in everything from mobile phones to refrigerators to automobiles to wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on/off switch contains a circuit board. Due to their versatility, the use of flex circuits is one of the fastest growing product market segments.   With the introduction of flex and rigid-flex circuits, engineers have been given the opportunity to be more creative in designing new and innovative products. Flex and rigid-flex boards are built to fit into tight, three-dimensional [...]

High Speed PCB Design

Hitechcircuits’ experts work closely with customers to provide consulting and guidance for EMC and SI design throughout the PCB design process in the following areas:   System-Level Architecture and floor-planning, main boards, daughterboards, backplanes, connectors, cables, grounding. Enclosure design and shielding, installation practice.   Schematic Review High-speed signals, differential signaling, I/O interfaces (digital/analog, telecom and local-area network), magnetics, filters, connectors, power supply filtering and board decoupling/bypassing.   PCB Design Stackup selection and layer assignment, partitioning, routing high-speed and other critical nets, termination, noise-coupling mechanisms and prevention, common-mode suppression, I/O and filtering, high-voltage clearances, power-supply, decoupling and bypassing, power and ground [...]