The Printed Circuit Board industry moves eastward and the mainland is unique. The focus of the PCB industry is constantly shifting to the Asian region, and Asia’s production capacity is further transferred to the mainland, forming a new industrial structure. With the continuous transfer of production capacity, mainland China has become the region with the highest PCB production capacity in the world.


Applications such as data centers will increase HDI board demand, and FPC will have broad prospects. Data centers are moving in the direction of high speed, high capacity, cloud computing and high performance, and construction demand is exploding. The demand for servers will also increase the overall demand for HDI PCB. The popularity of mobile electronic products such as smartphones will also drive demand for FPC boards. In the trend of smart, lightweight mobile electronics, the FPC’s light weight, thin thickness and resistance to bending will benefit its wide range of applications. The demand for FPC in display modules, touch modules, fingerprint recognition modules, side buttons, power buttons and other parts of smartphones is increasing.


New applications are driving industry growth, and the 5G era is getting closer. The 5G new communication base station has a large demand for high-frequency circuit boards: compared with the number of million-level base stations in the 4G era, the base station scale in the 5G era is expected to exceed tens of millions. High-frequency high-speed boards that meet the 5G requirements have broader technical barriers than traditional products and have higher gross margins.


The development trend of automotive electronics is driving the rapid growth of automotive PCBs. With the deepening of electronic and electronic technology, the demand for automotive PCBs will gradually increase. Compared with traditional cars, new energy vehicles have higher requirements for the degree of electronicization. The cost of electronic equipment for traditional luxury cars is about 25%, and the cost for new energy vehicles is 45% to 65%. Among them, BMS will become a new growth point of automotive RF PCB, and high frequency PCB equipped with millimeter wave radar requires a lot of rigidity.