IPC announces the release of five newly revised standards covering several areas of the supply chain.


IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies

IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-2591-Version 1.1, Connected Factory Exchange (CFX)

IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards



Details on some of the changes for the newly released standards:


IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.


There are several new or revised graphics

The solderless wrap section was completely revised

A new section was added for over-molding of flexible flat ribbon

IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.


Several figures are updated

New sections and comments on microvia stacking

Back-drilled holes and dual row zero insertion force (ZIF) connectors updated

IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.


Provides new acceptance criteria for back drilled holes

Establishes new requirements for copper wrap plating of holes in new designs

Discusses reliability issues for microvia structures in class 3 products

IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.


provides changes made to message sections, and message structure sections

Appendix A was added with a short description of all changes from V1.0

Appendix B provides acronyms and abbreviations

IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.


New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations

Several sections have been updated from Scope through and including 3.0—requirements

Classifications of Class I, 2 and 3 have been added