High Density Interconnect PCB

//High Density Interconnect PCB

General Information for High density pcb (HDI PCB)

HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.

HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

High Density PCB is used extensively in applications and industries including:
● Cell phone ● GPS
● Telecom ● ASemiconductor
● Automotive ● Military
● Medical ● Instrumentation

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170(Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark

10L every layer interconnection(ELIC) HDI PCB

Technical description Layer count:  10 layer Board thickness:0.80mm Raw material:FR4 370HR Min.line width/space:0.075/0.075mm Minimum hole diameter:0.10mm Surface finishing:ENIG Plug via-in-pad by resin and plate flat

10L stage 2 Automotive HDI PCB

Technical description Layer count: 2 stage 10 layer Board thickness:1.0mm Dimension:160*130mm Raw material:FR4 EM825 Copper thickness on the board surface:≥35um Copper thickness in the hole barrel:20um Min.line width/space:0.075mm Minimum hole diameter:0.1mm Surface finishing:immersion gold≥2u" Application:automotive driving recorder

10L High Density Interconnect pcb

Technical description 10L High Density Interconnect board Laminate: FR4, Tg150 Board thickness: 1.6mm Copper thickness: 17.5um (Hoz) for all layers Solder resist: green color Surface Finish: Immersion gold Trace width/width: 0.89/0.1mm Min. holes:0.1mm Controlled Impedance Board stack up: 1+1+6+1+1 Application: Industry control

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control

8L Cell phone HDI board PCB

Technical description 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.075mm Minimum line spacing: 0.075mm Laser drilling + blind and

6 Layers HDI PCB

Technical description 6L High density PCB (HDI PCB) for intercom Board dimensions: 80 x 120mm Finished board thickness: 1.0mm Material: FR-4 Tg150 halogen free Minimum holes size: 0.1mm Minimum line width/clearance: 2/3mil Copper thickness: T oz (12um) Solder mask: top and bottom (color: Blue) Silkscreen: top (color: white) Finish: immersion gold (top and bottom) Board stack up: 1 + 4 + 1

6L HDI printed circuit board for Intercom

Technical description 10L multilayer pcb Technical description Material: FR-4 Tg170 Board thickness: 1.6mm Surface finished: Immersion gold+Controlled Impedance Copper thickness: 1 Oz for all layers Min.line width/space: 4mil Min through hole: 0.15mm