Project Description
ELIC HDI PCB Board 10L
Hitech’s 10 layer interconnection (ELIC) HDI pcb with electroless nickel immersion (ENIG) surface treatment which made of raw material FR4 370 HR, plug via-in-pad by resin and plate flat. ENIG becomes the most popular surface finish in the industry. It’s a double layer metallic coating, nickel acting as both a barrier to the copper and a surface to components are soldered. There is a layer of gold protects the nickel during storage. The advantages of ENIG high density boards are lead-free, flat surfaces, strong etc.
Technical Parameters
- Layer count: 10 layer
- Board thickness：0.80mm
- Raw material：FR4 370HR
- Min.line width/space：0.075/0.075mm
- Minimum hole diameter：0.10mm
- Surface finishing：ENIG
- Plug via-in-pad by resin and plate flat
