Project Description
Led pcb fabrication and assembly
Aluminum substrate of LED pcb fabrication and assembly compose of aluminum plate with high thermal insulation material, which uses in led lamps and lanterns. Hitech’s advanced manufacturing and testing capabilities to ensure circuit boards 100% in compliance with design.
Technical Parameters
- Led pcb fabrication and assembly
- Product type: Aluminum Substrate
- Material: Aluminum plate +high thermal insulation material
- Layer/Thickness: 1L/1 mm
- Outer Copper:/ 2 OZ
- Surface treatment: HASL LF
- Min Line Width: ≥ 0.5mm
- Min Line Space: ≥0.3mm
- Min Hole: ≥0.4 mm
- Solder Mask: White X 1 side
- Silkscreen: Black
- Technical featuer: special materials
- Application: Lamps and lanterns
- BOM List: As request
