Project Description

  • Ceramic PCB fabrication and Electronics assembly

Ceramic PCB fabrication and electronics assembly

Hitech focus on one-stop electronic manufacturing services (EMS) including ceramic pcb fabrication and electronics assembly, SMT assembly, through hole soldering. All products are widely used in electronic equipment.

Technical Parameters

  • Product type: ALN Ceramic Substrate
  • Material: Aluminum Nitride Ceramic 180W/m.K
  • Layer/Thickness: 1L/1.5mm
  • Outer Copper: 1 OZ
  • Surface treatment: Hard gold
  • Solder Mask: White X 1 side
  • Technical featuer: special materials