Hitech Group provides PCBA assembly, from PCBA sample to medium MASS production volume. Our professional SMT factory has advanced equipments, such as the world-class stencil printing, SMT chip pick & place, solder reflow, and in-line testing and steel mesh manufacturing. AOI test machine and X-ray testing machines for quality check.
Here below is our main services for PCB assembly manfacturing:
Please provice BOM, so we can check and quote electronic parts and assembly prices. Thanks.
- Surface Mount Technology
- Pin Through-hole Assembly
- Selective Wave Soldering
- Conformal Coating
- Complete box build assembly
- Inspection Methods
Surface Mount Technology
POE all products follow IPC2 standards.With 18 years experience of placing BGA, UBGA, CSP and small profile passives down to and including 0201, POE offers a cost effective high yield solution to any SMT requirement.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 40″ x 40″. Placement rates reach 15000 pieces per hour with an accuracy of 99% minimizing component loss.
POE have 2 kinds of solutions. Leadfree and leaded soldering process.
Each solutions room are divided into 2 seperated places. so there is no mix up.
Selective Wave Solder
Having the Selective Wave soldering machines, POE achieves consistent quality and process control when assembling boards having multiple ground and power planes, high-current connectors or A-typical distribution of components. All AOI tested before QC.IPQC.
Both dip-coating and vertical spray coating is available. Protecting non conductive dielectric layer that is applied onto the printed circuit board assembly to protect the electronic assembly from damage due to contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. When coated, it is clearly visible as a clear and shiny material.
Complete box build assembly
Complete ‘Box Build assembly’ solutions including materials management of all components, electromechanical parts, plastics, casings and print & packaging material
•Checks for solder paste
•Checks for components down to 0201″
•Checks for missing components, offset, incorrect parts, polarity
X-Ray provides high-resolution inspection of:
•Chip scale packages
•Bare boardsIn-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
•Advanced Function Test
•Flash Device Programming