Today I will share the impact assessment of batch process of 40Z and above (inclusive) copper thickness of heavy copper PCB with you. Hope it will be helpful to you.
Note: ○ indicates no effect; △ indicates a certain influence; ☆ indicates a direct effect.
|1||Inner layer||At present, 4OZ and above (inclusive) copper thickness material codes of the inner layer circuit is made from outer dry film.||○|
|2||Lamination||4OZ and above material codes need to use special PP for filter processing||☆|
|3||Drilling||Drill pinhole limit is reduced, corresponding drill consumption increased||☆|
|4||Electroplating||Except for the special high aspect ratio material number, others can be normal operating conditions||○|
|5||Dry film||Corresponding inner circuit is made from outer dry film, the production capacity need to be considered||☆|
|6||Etching||In order to reduce the difference between the upper and the lower line, multiple etching is needed, and the corresponding etching speed needs to be reduced||☆|
|7||Anti-welding||The inner thick copper parts have no effect, and the outer thick copper anti welding is required 2 times printing to avoid skip printing and air bubbles||☆|
|8||Characters||Pay attention to the oil condition of the character on the shoulder of the circuit||△|
|9||Spray tin||The heavy copper PCB is weightie|