heavy copper pcb

 

Today I will share the impact assessment of batch process of 40Z and above (inclusive) copper thickness of heavy copper PCB with you. Hope it will be helpful to you.

Note: indicates no effect; indicates a certain influence; indicates a direct effect.

 

Items Category Influence Influence degree
1 Inner layer At present, 4OZ and above (inclusive) copper thickness material codes of the inner layer circuit is made from outer dry film.
2 Lamination 4OZ and above material codes need to use special PP for filter processing
3 Drilling Drill pinhole limit is reduced, corresponding drill consumption increased
4 Electroplating Except for the special high aspect ratio material number, others can be normal operating conditions
5 Dry film Corresponding inner circuit is made from outer dry film, the production capacity need to be considered
6 Etching In order to reduce the difference between the upper and the lower line, multiple etching is needed, and the corresponding etching speed needs to be reduced
7 Anti-welding The inner thick copper parts have no effect, and the outer thick copper anti welding is required 2 times printing to avoid skip printing and air bubbles
8 Characters Pay attention to the oil condition of the character on the shoulder of the circuit
9 Spray tin The heavy copper PCB is weightie