Today I will share the impact assessment of batch process of 40Z and above (inclusive) copper thickness of heavy copper PCB with you. Hope it will be helpful to you.
Note: ○ indicates no effect; △ indicates a certain influence; ☆ indicates a direct effect.
| Items | Category | Influence | Influence degree |
| 1 | Inner layer | At present, 4OZ and above (inclusive) copper thickness material codes of the inner layer circuit is made from outer dry film. | ○ |
| 2 | Lamination | 4OZ and above material codes need to use special PP for filter processing | ☆ |
| 3 | Drilling | Drill pinhole limit is reduced, corresponding drill consumption increased | ☆ |
| 4 | Electroplating | Except for the special high aspect ratio material number, others can be normal operating conditions | ○ |
| 5 | Dry film | Corresponding inner circuit is made from outer dry film, the production capacity need to be considered | ☆ |
| 6 | Etching | In order to reduce the difference between the upper and the lower line, multiple etching is needed, and the corresponding etching speed needs to be reduced | ☆ |
| 7 | Anti-welding | The inner thick copper parts have no effect, and the outer thick copper anti welding is required 2 times printing to avoid skip printing and air bubbles | ☆ |
| 8 | Characters | Pay attention to the oil condition of the character on the shoulder of the circuit | △ |
| 9 | Spray tin | The heavy copper PCB is weightier than ordinary products, be aware of scratching | △ |
| 10 | Forming | △ | |
| 11 | Test | △ | |
| 12 | Visual inspection | △ |
More information, please visit www.hitechcircuits.com.
