Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

///Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

 

heavy copper pcb

 

Today I will share the impact assessment of batch process of 40Z and above (inclusive) copper thickness of heavy copper PCB with you. Hope it will be helpful to you.

Note: indicates no effect; indicates a certain influence; indicates a direct effect.

 

Items Category Influence Influence degree
1 Inner layer At present, 4OZ and above (inclusive) copper thickness material codes of the inner layer circuit is made from outer dry film.
2 Lamination 4OZ and above material codes need to use special PP for filter processing
3 Drilling Drill pinhole limit is reduced, corresponding drill consumption increased
4 Electroplating Except for the special high aspect ratio material number, others can be normal operating conditions
5 Dry film Corresponding inner circuit is made from outer dry film, the production capacity need to be considered
6 Etching In order to reduce the difference between the upper and the lower line, multiple etching is needed, and the corresponding etching speed needs to be reduced
7 Anti-welding The inner thick copper parts have no effect, and the outer thick copper anti welding is required 2 times printing to avoid skip printing and air bubbles
8 Characters Pay attention to the oil condition of the character on the shoulder of the circuit
9 Spray tin The heavy copper PCB is weightier than ordinary products, be aware of scratching
10 Forming
11 Test
12 Visual inspection

More information, please visit www.hitechcircuits.com.

 

 

2016-09-23T06:46:29+00:00 Categories: PCB knowledge|