HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.

 

Following is the advantages for the HDI PCB.

  1. This technology allows future components, that are becoming smaller, to be used on a wider scale.
  2. Electrical performance: The smaller parts used on HDI boards, have shorter internal wire lengths, reduced rise times, and lower power requirements when compared to their larger, alternative packages.
  3. Creating agateway to Miniaturization of PCB design with ‘Via in Pad’ technology.
  4. Improved reliability by stepping up technology rather than compromising existing design rules.
  5. Giving a wider array of design choices when it comes to BGA layout with the smallest pitch.
  6. Opportunities for better thermal enhancement.
  7. Increasing interconnection density by reducing plated thru holes, pad size and conductor size reduction.
  8. Provides to have via hole connected directly on the surface mount pad or BGA pad.