High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.



HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.


HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.


HDI PCB fabrication deploys advanced multilayer technology which allows you to integrate multiple layers to create a multilayered PCB.


There are six main types of HDI PCB boards. These are the HDI PCBs with:

1.Through vias from the surface to surface,

2.Buried vias and through vias,

3.Two or more HDI layer with through vias,

4.The passive substrate is not electrically connected,

5.Coreless construction using layer pairs, and

6.Alternate constructions of coreless constructions using layer pairs.



HDI boards usually come with apertures within the range of 3.0-6.0mil, and a line width within the range of 3.0-4.0mil. With these features, you minimize the pad size significantly, fitting in a broader layout within each unit area.


Another crucial feature of HDI boards is the blind vias, buried vias and micro vias lesser than .0006mm in diameter. All of these vias allow you to save more space on your HDI board.


A blind via is akin to a through-hole via which terminates somewhere inside the board instead of passing through. A buried via only connects the internal layers of the board, and not external layers .


As a result of having these features, HDI PCBs come with a higher circuitry density when compared to regular PCBs.