Technical description 18L multilayer board Technical description Material: FR-4 Tg180 Board thickness: 2.2mm Surface finished: Immersion gold+Controlled Impedance Copper thickness: 1 Oz for all layers Min.line width/space: 4mil Min through hole: 0.25mm Medical
Technical description Product type: Multilayer Board Material: Fr4 S1000-2 Application filed: Electronics Equipment Layer/thickness: 4L/1.6mm Surface treatment: ENIG Line space/width: 0.15/0.15mm Minimum hole size: 0.3mm Technical Feature: Fine line, impedance control Components: As Bom list Wireless Charger PCBA Circuit Board
Technical description 10L multilayer printed wiring board Technical description Material: FR-4 Tg170 Board thickness: 1.6mm Surface finished: Immersion gold+Controlled Impedance Copper thickness: H Oz for all layers Min.line width/space: 3.5mil Min through hole: 0.2mm Communications
Technical description 10L multilayer pcb Technical description Material: FR-4 Tg170 Board thickness: 1.6mm Surface finished: Immersion gold+Controlled Impedance Copper thickness: 1 Oz for all layers Min.line width/space: 4mil Min through hole: 0.15mm
Technical description 8L multilayer printed circuit board Technical description Material: FR-4 Tg170 Board thickness: 1.60mm Surface finished: Immersion gold Copper thickness: 1 Oz for all layers Min.line width/space: 4/4mil Min through hole: 0.2mm Communicationl
Technical description 6L multilayer printed circuit board Technical description Material: FR-4 Tg170 Board thickness: 1.58mm Surface finished: Immersion gold Copper thickness: 1 Oz for all layers Min.line width/space: 5mi Min through hole: 0.2mm Medical
Technical description 6L multilayer printed circuit board Technical description Material: FR4 Tg170℃ Board thickness: 1.58mm Surface finished: ENEPIG Copper thickness: 1 Oz for all layers Suitable for gold bonding
Technical description 6L multilayer printed circuit board Technical description Material: FR4 Tg135℃ Board thickness: 1.58mm Surface finished: HASL Copper thickness: 1 Oz for all layers Unit size/mm: 160*234mm
Technical description 4L multilayer printed circuit board Technical description Material: FR4 Tg170℃ Halogen free Board thickness: 1.58mm Surface finished: Immersion gold Copper thickness: 1 Oz for all layers IPC class 3
Technical description 4L PCB Technical description Material: FR-4 Tg135 Board thickness: 1.60mm Surface finished: HASL LF Copper thickness: 1/1/1/1 oz Solder mask: Green Min Line Width/Spacing:0.127mm/0.127mm