High density Printed circuit board

/Tag: High density Printed circuit board

Hitech Company profile

China PCB Manufacturer, PCB Fabrication& Board Assembly in China Printed Circuit Board Manufacturing which is our major business. I think you already know, we are a PCB manufacturer. We have 3 branch factories dedicated to Quick Turn PCB Prototypes Manufacturing, Small and Medium-volume Printed Circuit Board and FPC Manufacturing services. Our market target is the High Multilayer PCB, High Density board, Special Material & Process Printed Circuit Boards. Also, we can help customer do PCB assembly and provide one-stop service. Hitech Group is capable of providing full turn-key and partial turn-key PCB assembly services. For full turn-key, we take care [...]

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]

PCB Paneling – Points to Discuss with Your Manufacturer

Printed Circuit Board (PCB) manufacturing is a detailed and time consuming process. PCB assembly is one of the vital procedures in the entire production run. It consists of processes such as component placement, solder paste deposition, and solder printing, among others. If you want your PCB to meet all the application requirements, it is important that you have some basic knowledge about the PCB assembly process.   PCB Assembly – Understanding PCB Paneling Generally, if you read posts on PCB Assembly, you will mainly find information on aspects like mounting technologies (SMT or PTH), or various types of substrate materials. [...]

Soldering Processes for Printed Circuit Boards – Preparation and Component Removal

Printed Circuits Boards (PCBs) have become an essential product for many industrial applications. They do not take up much space in an application, nor do they add immense weight to the application product. They minimize electric noise in the product, and are easy to maintain and repair. In this post, we shall be discussing the PCB soldering process.   Pre-soldering Procedures As there are a variety of procedures within soldering, we shall be focusing on soldering preparation and component removal phases.   General purpose cleaner Desolder tool Soldering iron, solder, flux Desolder Braid Microscope Wipes   Choose the Right Soldering [...]

High end PCB for electronic digital

Technical description Product type: Mutilayer circuit boards Material: FR4 S1000-2 Application field: Security Layer/thickness: 12L/1.0mm Surface treatment: Immersion gold Line space/Width: 4/4mil Minimum hole diameter: 0.2mm Technical feature: Fine line impedance control

PCB REVERSE ENGINEERING–From Hitech Circuits Co., Limited

PCB Reverse Engineering, also known as PCB Cloning or PCB Copy.The PCB copy ‘s work cloning the circuit board, producing samples, replacing components, making BOM list, derived schematic. PCB Reverse Engineering using Reverse Engineering technology onto the PCB which was designed and manufactured by others, it is to use PCB Board related software to copy someone else’s printed circuit board and then manufacture the pcb circuit board by yourself.With the PCB Reverse Engineering technology development, To the wide sense that PCB Reverse Engineering not only include PWB file extraction, PCB Cloning and PCB Copy and other related technical aspect, but [...]

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.   Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.   HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.   HDI PCB fabrication deploys advanced multilayer technology [...]

Electronic board printed circuit board assembly(PCBA)

Technical description Production type: Multilayer layer Material: FR4 S1000-2 Application filed: Communication equipment Layer/thickness: 6L/1.6mm Surface treatment: Gold plating Line space/width: 3/3mil Minimum hole diameter: 0.3mm Technical feature:impedance control

Common Issues You Should Avoid When Transitioning to Machine PCB Assembly- PCB fabrication

Making any kind of change can come with its fair share of frustrations and pitfalls, but those issues can just about double when it comes to change in a highly technical industry like printed circuit board (PCB) fabrication. So when it comes time for you to make the switch from hand-made PCBs to automated PCB assembly, it's important to know what you're up against. Are you ready to learn what to watch out for during this tricky transition? If you answered yes, keep reading.   Lack of Silkscreen When the time comes for you to make the move to automated [...]

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control