High density Printed circuit board

/Tag: High density Printed circuit board

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]

The difference between Core and Prepreg

The Prepreg is an insulating material for the PCB. Prepreg is not prepreg before being laminated, also known as prepreg,prior to lamination, and is primarily used as a bonding material and an insulating material for the inner conductive pattern of a multilayer printed circuit board. After the Prepreg is laminated, the semi-cured epoxy is extruded, begins to flow and solidifies, bonds the multilayer sheets together and forms a reliable insulator.   The Core is the basic material for making printed circuit boards. The Core is also known as the core board, which has a certain hardness and thickness, as well [...]

Hitech Company profile

China PCB Manufacturer, PCB Fabrication& Board Assembly in China Printed Circuit Board Manufacturing which is our major business. I think you already know, we are a PCB manufacturer. We have 3 branch factories dedicated to Quick Turn PCB Prototypes Manufacturing, Small and Medium-volume Printed Circuit Board and FPC Manufacturing services. Our market target is the High Multilayer PCB, High Density board, Special Material & Process Printed Circuit Boards. Also, we can help customer do PCB assembly and provide one-stop service. Hitech Group is capable of providing full turn-key and partial turn-key PCB assembly services. For full turn-key, we take care [...]

What are the advantages of HDI PCB technology-Hitech PCB

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.   Following is the advantages for the HDI PCB. This technology allows future components, that are becoming smaller, to be used on a wider scale. Electrical [...]

PCB Paneling – Points to Discuss with Your Manufacturer

Printed Circuit Board (PCB) manufacturing is a detailed and time consuming process. PCB assembly is one of the vital procedures in the entire production run. It consists of processes such as component placement, solder paste deposition, and solder printing, among others. If you want your PCB to meet all the application requirements, it is important that you have some basic knowledge about the PCB assembly process.   PCB Assembly – Understanding PCB Paneling Generally, if you read posts on PCB Assembly, you will mainly find information on aspects like mounting technologies (SMT or PTH), or various types of substrate materials. [...]

Soldering Processes for Printed Circuit Boards – Preparation and Component Removal

Printed Circuits Boards (PCBs) have become an essential product for many industrial applications. They do not take up much space in an application, nor do they add immense weight to the application product. They minimize electric noise in the product, and are easy to maintain and repair. In this post, we shall be discussing the PCB soldering process.   Pre-soldering Procedures As there are a variety of procedures within soldering, we shall be focusing on soldering preparation and component removal phases.   General purpose cleaner Desolder tool Soldering iron, solder, flux Desolder Braid Microscope Wipes   Choose the Right Soldering [...]

High end PCB for electronic digital

Technical description Product type: Mutilayer circuit boards Material: FR4 S1000-2 Application field: Security Layer/thickness: 12L/1.0mm Surface treatment: Immersion gold Line space/Width: 4/4mil Minimum hole diameter: 0.2mm Technical feature: Fine line impedance control

PCB REVERSE ENGINEERING–From Hitech Circuits Co., Limited

PCB Reverse Engineering, also known as PCB Cloning or PCB Copy.The PCB copy ‘s work cloning the circuit board, producing samples, replacing components, making BOM list, derived schematic. PCB Reverse Engineering using Reverse Engineering technology onto the PCB which was designed and manufactured by others, it is to use PCB Board related software to copy someone else’s printed circuit board and then manufacture the pcb circuit board by yourself.With the PCB Reverse Engineering technology development, To the wide sense that PCB Reverse Engineering not only include PWB file extraction, PCB Cloning and PCB Copy and other related technical aspect, but [...]

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.   Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.   HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.   HDI PCB fabrication deploys advanced multilayer technology [...]

Electronic board printed circuit board assembly(PCBA)

Technical description Production type: Multilayer layer Material: FR4 S1000-2 Application filed: Communication equipment Layer/thickness: 6L/1.6mm Surface treatment: Gold plating Line space/width: 3/3mil Minimum hole diameter: 0.3mm Technical feature:impedance control