High density Printed circuit board

/Tag: High density Printed circuit board

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]

PCB REVERSE ENGINEERING–From Hitech Circuits Co., Limited

PCB Reverse Engineering, also known as PCB Cloning or PCB Copy.The PCB copy ‘s work cloning the circuit board, producing samples, replacing components, making BOM list, derived schematic. PCB Reverse Engineering using Reverse Engineering technology onto the PCB which was designed and manufactured by others, it is to use PCB Board related software to copy someone else’s printed circuit board and then manufacture the pcb circuit board by yourself.With the PCB Reverse Engineering technology development, To the wide sense that PCB Reverse Engineering not only include PWB file extraction, PCB Cloning and PCB Copy and other related technical aspect, but [...]

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.   Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.   HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.   HDI PCB fabrication deploys advanced multilayer technology [...]

Electronic board printed circuit board assembly(PCBA)

Technical description Production type: Multilayer layer Material: FR4 S1000-2 Application filed: Communication equipment Layer/thickness: 6L/1.6mm Surface treatment: Gold plating Line space/width: 3/3mil Minimum hole diameter: 0.3mm Technical feature:impedance control

Common Issues You Should Avoid When Transitioning to Machine PCB Assembly- PCB fabrication

Making any kind of change can come with its fair share of frustrations and pitfalls, but those issues can just about double when it comes to change in a highly technical industry like printed circuit board (PCB) fabrication. So when it comes time for you to make the switch from hand-made PCBs to automated PCB assembly, it's important to know what you're up against. Are you ready to learn what to watch out for during this tricky transition? If you answered yes, keep reading.   Lack of Silkscreen When the time comes for you to make the move to automated [...]

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control

Printed circuit board manufacturing process how to Measure Solder Mask Thickness

For printed circuit board, the solder mask is an essential element in printed circuit board manufacturing. Without a quality solder mask, most printed circuit boards wouldn’t last very long. There are several elements that go into creating an effective solder mask, and it’s a key feature of your printed circuit board’s makeup. What is a Solder Mask Solder mask is a material used to protect the copper on the circuit board with a protective layer of liquid photo imageable lacquer. This mask goes on both sides of the circuit board to protect the copper from problems that could lead to [...]

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170(Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark

10L every layer interconnection(ELIC) HDI PCB

Technical description Layer count:  10 layer Board thickness:0.80mm Raw material:FR4 370HR Min.line width/space:0.075/0.075mm Minimum hole diameter:0.10mm Surface finishing:ENIG Plug via-in-pad by resin and plate flat

10L stage 2 Automotive HDI PCB

Technical description Layer count: 2 stage 10 layer Board thickness:1.0mm Dimension:160*130mm Raw material:FR4 EM825 Copper thickness on the board surface:≥35um Copper thickness in the hole barrel:20um Min.line width/space:0.075mm Minimum hole diameter:0.1mm Surface finishing:immersion gold≥2u" Application:automotive driving recorder