High density PCB

/Tag: High density PCB

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]

High Density Interconnect PCB

High density pcb 10LHigh Density Interconnects pcb (HDI pcb) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market
segments. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit
boards (PCB).
They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.   Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.   HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.   HDI PCB fabrication deploys advanced multilayer technology [...]

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control

Rohs multilayer pcb board manufacturer

Technical description Material: Fr4 s1000-2 TG80 Layer/thickness: 6L/1.6mm Layer/Thickn: 2 OZ Surface treatment: ENIG Min. Hole Size:0.3mm Min. Line Width:0.15mm Min. Line Spacing:0.25mm Technical featuer: Fine line Application field: Electronics Equipment Rohs multilayer pcb board manufacturer

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170(Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark

10L every layer interconnection(ELIC) HDI PCB

Technical description Layer count:  10 layer Board thickness:0.80mm Raw material:FR4 370HR Min.line width/space:0.075/0.075mm Minimum hole diameter:0.10mm Surface finishing:ENIG Plug via-in-pad by resin and plate flat

10L stage 2 Automotive HDI PCB

Technical description Layer count: 2 stage 10 layer Board thickness:1.0mm Dimension:160*130mm Raw material:FR4 EM825 Copper thickness on the board surface:≥35um Copper thickness in the hole barrel:20um Min.line width/space:0.075mm Minimum hole diameter:0.1mm Surface finishing:immersion gold≥2u" Application:automotive driving recorder

10L High Density Interconnect pcb

Technical description 10L High Density Interconnect board Laminate: FR4, Tg150 Board thickness: 1.6mm Copper thickness: 17.5um (Hoz) for all layers Solder resist: green color Surface Finish: Immersion gold Trace width/width: 0.89/0.1mm Min. holes:0.1mm Controlled Impedance Board stack up: 1+1+6+1+1 Application: Industry control

8L Cell phone HDI board PCB

Technical description 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.075mm Minimum line spacing: 0.075mm Laser drilling + blind and