High Density Interconnection PCB

/Tag: High Density Interconnection PCB

PCB Manufacturing and PCB Assembly Step-by-Step Guide for Electronic Assembly process

Printed Circuit Board or PCB’s are an integral part of every electronic device. They are the green chips that you can find within all electronic devices. These green chips or Printed Circuit Boards are printed with copper lines called traces, which carry signals to various components. This systematic transmission of signals ensures the proper functioning of the electronic device. PCBs are omnipresent in every modern day electronic device. As the technology advances and the electronic devices becoming more and more compact, there is a drastic reduction in the size of the PCB. This reduction in size increases the complexity of [...]

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry.   Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously.   HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties.   HDI PCB fabrication deploys advanced multilayer technology [...]

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control

DESIGNING FLEXIBLE PRINTED CIRCUIT BOARDS (Part Two)

High-density-Interconnect (HDI) Flexible PCBs When there are no adequate options provided by typical flexible circuits, HDI PCBs come into play by incorporating fine features like micro-vias, better layout, construction, and design. In addition to the above features, other features include; highly dense flex circuitry, Increased functionality, and smaller form factor. HDI technology offers improved electrical performance, access to advanced IC package use, and better reliability though it makes use of thinner materials.   Benefits of Flex Circuits As for a ribbon cable or discrete wiring replacement, customized repeatable routing supplied by flex circuits trails all through the assembly. Because of [...]

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170(Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark

PCB manufacturing-What Is Trace Impedance

In printed circuit boards, wires and traces are typically formed from copper because it is the least-resistant element apart from silver. Put an ohm meter over a trace and the DC resistance is almost negligible. The same cannot be said of AC impedance. Impedance, unlike resistance, is based on frequency. All wires and traces will generate at least some impedance to current flowing from any driver. While, usually, you must have a fairly fast rise time for your signals for trace impedance to become a problem, it’s important that you be aware that trace impedance exists and can become an [...]

10L every layer interconnection(ELIC) HDI PCB

Technical description Layer count:  10 layer Board thickness:0.80mm Raw material:FR4 370HR Min.line width/space:0.075/0.075mm Minimum hole diameter:0.10mm Surface finishing:ENIG Plug via-in-pad by resin and plate flat

10L stage 2 Automotive HDI PCB

Technical description Layer count: 2 stage 10 layer Board thickness:1.0mm Dimension:160*130mm Raw material:FR4 EM825 Copper thickness on the board surface:≥35um Copper thickness in the hole barrel:20um Min.line width/space:0.075mm Minimum hole diameter:0.1mm Surface finishing:immersion gold≥2u" Application:automotive driving recorder

10L High Density Interconnect pcb

Technical description 10L High Density Interconnect board Laminate: FR4, Tg150 Board thickness: 1.6mm Copper thickness: 17.5um (Hoz) for all layers Solder resist: green color Surface Finish: Immersion gold Trace width/width: 0.89/0.1mm Min. holes:0.1mm Controlled Impedance Board stack up: 1+1+6+1+1 Application: Industry control

8L Cell phone HDI board PCB

Technical description 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.075mm Minimum line spacing: 0.075mm Laser drilling + blind and