High Density Interconnection PCB | Hitech Circuits Co., Ltd.

Printed Circuit Board industry accelerates transfer to China

The industry moves eastward and the mainland is unique. The focus of the PCB industry is constantly shifting to the Asian region, and Asia's production capacity is further transferred to the mainland, forming a new industrial structure. With the continuous transfer of production capacity, mainland China has become the region with the highest PCB production capacity in the world. Applications such as data centers will increase HDI demand, and FPC will have broad prospects. Data centers are moving in the direction of high speed, high capacity, cloud computing and high performance, and construction demand is exploding. The demand for [...]

Andy Liu2019-10-21T14:52:28+00:00Categories: Blog|Tags: circuit board assembly, fast pcb assembly, heavy copper printed circuit board, High Density Interconnection PCB, printed circuit Board Assembly|

Hitech Company profile

China PCB Manufacturer, PCB Fabrication& Board Assembly in China Printed Circuit Board Manufacturing which is our major business. I think you already know, we are a PCB manufacturer. We have 3 branch factories dedicated to Quick Turn PCB Prototypes Manufacturing, Small and Medium-volume Printed Circuit Board and FPC Manufacturing services. Our market target is the High Multilayer PCB, High Density board, Special Material & Process Printed Circuit Boards. Also, we can help customer do PCB assembly and provide one-stop service. Hitech Group is capable of providing full turn-key and partial turn-key PCB assembly services. For full turn-key, we take care [...]

Organizational Structure

Over the years we have been insisting technological innovation, excellence, so that people well-know Hitech Circuits Co., Limited – "Specializes in High Multi-layer printed circuit board, High Density Interconnection PCB, Aluminium metal core PCB, Quick turn pcb assembly service, Special Materials and Special Process Printed Circuit Boards.". Today's Hitech Circuits Co.,Limited already has two branch factories: one is a Quick Turn PCB Prototype Factory, So it's all about we have a good management and good organizational structure inseparable. Our organization:

admin2019-09-07T17:21:10+00:00Categories: About Us|Tags: board assembly, electronic board assembly, High Density Interconnection PCB, Multi-layer printed circuit board, PCB Assembly, Quick turn pcb|

PCB Manufacturing and PCB Assembly Step-by-Step Guide for Electronic Assembly process

Printed Circuit Board or PCB’s are an integral part of every electronic device. They are the green chips that you can find within all electronic devices. These green chips or Printed Circuit Boards are printed with copper lines called traces, which carry signals to various components. This systematic transmission of signals ensures the proper functioning of the electronic device. PCBs are omnipresent in every modern day electronic device. As the technology advances and the electronic devices becoming more and more compact, there is a drastic reduction in the size of the PCB. This reduction in size increases the complexity of [...]

Andy Liu2019-03-16T12:53:24+00:00Categories: Blog|Tags: board assembly, Electronic assembly, Flex printed circuit board, High Density Interconnection PCB, Multi-layer printed circuit board, PCB Assembly, PCB assembly manufacturer|

The Definition and Features of HDI PCB (High density pcb)

High-Density Interconnection (HDI) board is one of the key technologies driving advancements in PCB electronics. Through its multiple via processes, HDI technology minimizes the number of layers, making for smaller yet more powerful PCB circuitry. Definition HDI, or High-Density Interconnection, is a PCB technology that emerged around the end of the 20th century. The advantages it holds over the traditional PCBs fueled its popularity tremendously. HDI PCB by laser drilling technology. That precludes the drawbacks you face when using the traditional mechanical drilling technology, including higher cost and improvement difficulties. HDI PCB fabrication deploys advanced multilayer technology [...]

Andy Liu2019-03-12T12:14:30+00:00Categories: Blog|Tags: HDI rigid flex pcb, High Density Interconnection PCB, High density PCB, High density Printed circuit board, pcb assembly china|

10L High density printed circuit board

Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control

newloong2019-03-12T12:14:31+00:00Categories: High Density Interconnect PCB, PCB Products|Tags: HDI PCB, HDI PCB manufacturer, High density interconnect pcb, High Density Interconnection PCB, High density PCB, High density Printed circuit board|

DESIGNING FLEXIBLE PRINTED CIRCUIT BOARDS (Part Two)

High-density-Interconnect (HDI) Flexible PCBs When there are no adequate options provided by typical flexible circuits, HDI PCBs come into play by incorporating fine features like micro-vias, better layout, construction, and design. In addition to the above features, other features include; highly dense flex circuitry, Increased functionality, and smaller form factor. HDI technology offers improved electrical performance, access to advanced IC package use, and better reliability though it makes use of thinner materials. Benefits of Flex Circuits As for a ribbon cable or discrete wiring replacement, customized repeatable routing supplied by flex circuits trails all through the assembly. Because of [...]

Andy Liu2019-03-12T12:14:32+00:00Categories: PCB knowledge, PCB News|Tags: flex pcb, Flex printed circuit board, flexible pcb manufacturer, High density Interconnect (HDI) Flexible PCBs, High Density Interconnection PCB, pcb design and assembly, pcb design and manufacturing|

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170（Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark

admin2019-03-12T12:14:32+00:00Categories: High Density Interconnect PCB|Tags: High Density Interconnection PCB, High density PCB, High density Printed circuit board|

PCB manufacturing-What Is Trace Impedance

In printed circuit boards, wires and traces are typically formed from copper because it is the least-resistant element apart from silver. Put an ohm meter over a trace and the DC resistance is almost negligible. The same cannot be said of AC impedance. Impedance, unlike resistance, is based on frequency. All wires and traces will generate at least some impedance to current flowing from any driver. While, usually, you must have a fairly fast rise time for your signals for trace impedance to become a problem, it’s important that you be aware that trace impedance exists and can become an [...]

Andy Liu2019-03-12T12:14:32+00:00Categories: Blog|Tags: Controlled Impedance, High Density Interconnection PCB, Impedance, TDR|

10L every layer interconnection(ELIC) HDI PCB

Technical description Layer count: 10 layer Board thickness：0.80mm Raw material：FR4 370HR Min.line width/space：0.075/0.075mm Minimum hole diameter：0.10mm Surface finishing：ENIG Plug via-in-pad by resin and plate flat

newloong2019-03-12T12:14:33+00:00Categories: High Density Interconnect PCB, PCB Products|Tags: High density interconnect pcb, High Density Interconnection PCB, High density PCB, High density Printed circuit board|