Technical description 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control
High-density-Interconnect (HDI) Flexible PCBs When there are no adequate options provided by typical flexible circuits, HDI PCBs come into play by incorporating fine features like micro-vias, better layout, construction, and design. In addition to the above features, other features include; highly dense flex circuitry, Increased functionality, and smaller form factor. HDI technology offers improved electrical performance, access to advanced IC package use, and better reliability though it makes use of thinner materials. Benefits of Flex Circuits As for a ribbon cable or discrete wiring replacement, customized repeatable routing supplied by flex circuits trails all through the assembly. Because of [...]
10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170（Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark
In printed circuit boards, wires and traces are typically formed from copper because it is the least-resistant element apart from silver. Put an ohm meter over a trace and the DC resistance is almost negligible. The same cannot be said of AC impedance. Impedance, unlike resistance, is based on frequency. All wires and traces will generate at least some impedance to current flowing from any driver. While, usually, you must have a fairly fast rise time for your signals for trace impedance to become a problem, it’s important that you be aware that trace impedance exists and can become an [...]
Technical description Layer count: 10 layer Board thickness：0.80mm Raw material：FR4 370HR Min.line width/space：0.075/0.075mm Minimum hole diameter：0.10mm Surface finishing：ENIG Plug via-in-pad by resin and plate flat
Technical description Layer count: 2 stage 10 layer Board thickness：1.0mm Dimension：160*130mm Raw material：FR4 EM825 Copper thickness on the board surface：≥35um Copper thickness in the hole barrel：20um Min.line width/space：0.075mm Minimum hole diameter：0.1mm Surface finishing：immersion gold≥2u" Application：automotive driving recorder
Technical description 10L High Density Interconnect board Laminate: FR4, Tg150 Board thickness: 1.6mm Copper thickness: 17.5um (Hoz) for all layers Solder resist: green color Surface Finish: Immersion gold Trace width/width: 0.89/0.1mm Min. holes:0.1mm Controlled Impedance Board stack up: 1+1+6+1+1 Application: Industry control
Technical description 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.075mm Minimum line spacing: 0.075mm Laser drilling + blind and
Technical description 6L High density PCB (HDI PCB) for intercom Board dimensions: 80 x 120mm Finished board thickness: 1.0mm Material: FR-4 Tg150 halogen free Minimum holes size: 0.1mm Minimum line width/clearance: 2/3mil Copper thickness: T oz (12um) Solder mask: top and bottom (color: Blue) Silkscreen: top (color: white) Finish: immersion gold (top and bottom) Board stack up: 1 + 4 + 1
Technical description 10L multilayer pcb Technical description Material: FR-4 Tg170 Board thickness: 1.6mm Surface finished: Immersion gold+Controlled Impedance Copper thickness: 1 Oz for all layers Min.line width/space: 4mil Min through hole: 0.15mm