High density Interconnect (HDI) Flexible PCBs

/Tag: High density Interconnect (HDI) Flexible PCBs

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards. Hitechpcb maintains years of experience with HDI products and [...]

flex-rigid pcb fabrication pcba assembly bluetooth pcb

Technical description Production type:  flex-rigid pcb Material: FR4 HighTG & PI Application filed: Communication equipment Layer/thickness: 4L/1.2mm Surface treatment: Gold plating Line space/width: 3/3mil Minimum hole diameter: 0.3mm Technical feature: flex-rigid PCB flex-rigid pcb fabrication pcba assembly bluetooth pcb

DESIGNING FLEXIBLE PRINTED CIRCUIT BOARDS (Part Two)

High-density-Interconnect (HDI) Flexible PCBs When there are no adequate options provided by typical flexible circuits, HDI PCBs come into play by incorporating fine features like micro-vias, better layout, construction, and design. In addition to the above features, other features include; highly dense flex circuitry, Increased functionality, and smaller form factor. HDI technology offers improved electrical performance, access to advanced IC package use, and better reliability though it makes use of thinner materials.   Benefits of Flex Circuits As for a ribbon cable or discrete wiring replacement, customized repeatable routing supplied by flex circuits trails all through the assembly. Because of [...]