component sourcing for pcb assembly–Hitech Circuits Co., Limited
Printed Circuit Board (PCB) Assembly Fully Automated Screen Printers with 2-D vision. Inline 3-D Solder Paste Inspection (SPI). Fully Automated Pick and Place Equipment capable of placing 01005 chip components and micro-BGA’s. Automated Optical Inspection (AOI) is performed on all surface mount components. Off line programming and quick change feeders allow for the utmost efficiency and flexibility in job change over. 3-D X-Ray for BGA and QFN components. Quick-change feeders for job flexibility. Dedicated lead and lead-free Selective Solder and Wave Solder equipment.