Aluminum based PCB︱MCPCB

/Tag: Aluminum based PCB︱MCPCB

Aluminum Nitride Ceramic AlN PCB fabrication and assembly

Technical description Aluminum Nitride Ceramic AlN PCB fabrication and assembly Product type: ALN Ceramic Substrate Material: Aluminum Nitride Ceramic 180W/m.K Layer/Thickness: 1L/1.5mm Outer Copper: 1 OZ Surface treatment: Hard gold Solder Mask: White X 1 side Technical featuer: special materials

Unique Design LED Aluminum PCB Board Bergquist material

Technical description Product type:Unique Design LED Bergquist Aluminum PCB Board Material: Bergquist Aluminum Base Layer/Thickness: 1L/1.6 mm Copper Thickness: 1 OZ Surface treatment: ENIG Solder Mask:White Technical featuer: Bergquist  HPL-03015 Application field: Industrial Products

high power 5730 LED square mirror-cob-aluminum-pcb with driver

Technical description high power 5730 LED square mirror-cob-aluminum-pcb with driver Product type: Aluminum Substrate Material: Aluminum plate +high thermal insulation material Layer/Thickness: 1L/1.6 mm Outer Copper:/ 1.5 OZ Surface treatment: HASL LF Min Line Width: ≥ 0.3mm Min Line Space: ≥0.25mm Min Hole: ≥3 mm Solder Mask: White X 1 side Technical featuer: special materials Application: Lamps and lanterns

MCPCB led board pcb fabrication and assembly

Technical description Product type: Aluminum Substrate Material: Aluminum plate +high thermal insulation material Layer/Thickness: 1L/1 mm Outer Copper:/ 2 OZ Surface treatment: HASL LF Min Line Width: ≥ 0.5mm Min Line Space: ≥0.3mm Min Hole: ≥0.4 mm Solder Mask: White X 1 side Silkscreen: Black Technical featuer: special materials Application: Lamps and lanterns BOM List: As request Related Keywords: Metal core pcb assembly custom pcb assembly Aluminium pcb assembly

COB MCPCB

COB MCPCB(known as Chip-on-Board Metal core pcb) is semi-conductor assembly technology, where micro-chip also known as die is electrically interconnected instead of using traditional assembly process or individual IC packaging on the final product board. COB MCPCB used in thermoelectric separation application products. For normal MCPCB, there's a dielectric layer between trace copper and metal core, and the thermal conductivity is limited by that dielectric layers, so value can only be 1~3 W/m.K. But using COB MCPCB, there's no such dielectric layer because chip (die) direct touch the metal core, so thermal conductivity value of COB MCPCB will be [...]