Project Description
High Density Interconnect PCB China (24 layers)
24 layers high density interconnect pcb (HDI PCB) can meet higher component density and smaller packaging requirements. Through the heat conduction channel and the solid-liquid phase change cavity, the temperature of the circuit board can be effectively reduced, and the service life of the pcb laminate can be improved. The pcb used to reduce size and weight, as well as to enhance electrical performance. Hitech’s high density interconnect pcb mainly uses in cell, Mp3 player, GPS, memory card, PDA, portable game console etc.
24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China
High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
Hitechpcb maintains years of experience with HDI products and was a pioneer of second generation microvias. Now offer an entire family of microvia technology solutions for your next generation products.
HDI Board General Information
High Density Interconnects (HDI) board are defined as a board (PCB) witha higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
HDI board is used to reduce size and weight, as well as to enhance electrical performance. According to layer up different, currently DHI board is divided into three basic types:
1) HDI PCB (1+N+1)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with lower I/O counts Fine line, microvia and registration technologies capable of 0.4 mm ball pitch Qualified material and surface treatment for Lead-free process Excellent mounting stability and reliability Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , UMPC, MP3 Player, PMP, GPS, Memory Card1+N+1 HDI PCB Structure:
2) HDI PCB (2+N+2)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with smaller ball pitch and higher I/O counts Increase routing density in complicated design Thin board capabilities Lower Dk / Df material enables better signal transmission performance Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , PDA, UMPC, Portable game console, DSC, Camcorder
HDI PCB Capabilities
Layers3 – 36 Layers
HDI Step 3+N+3
Min.Line Width0.05mm (2 mil)
Min.Line Space0.05mm (2 mil)
Min.Annular ring0.1mm (4 mil)
Min. Via0.1mm (4 mil)
Max.Size500mm X 800mm
MaterialFR4,High Tg220
Material thickness Start at 25um Plus copper
Copper thickness0.3 OZ to 10 OZ (10um – 350um)
Please contact us for more information about HDI PCB Board.
