Project Description
Copper PCB manufacturing
The copper pcb manufacturing by Hitech, raw material is FR4 TG180 S1000-2 finished gold plating. The thickness of the copper foil is an important factor that affects the characteristic impedance. The greater wire thickness, the smaller impedance, but the range of change is relatively small. In other words, thin copper foil is used to make fine wires to increase or control impedance.
Technical Parameters
Material: FR4 TG180 S1000-2
Production type: Multilayer laye
Application filed: Communication equipment
Layer/thickness: 6L/1.6mm
Surface treatment: Gold plating
Copper thicknes: 3 oz on all layers
Minimum hole diameter: 0.30mm
Technical feature:impedance control
Production type: Multilayer laye
Application filed: Communication equipment
Layer/thickness: 6L/1.6mm
Surface treatment: Gold plating
Copper thicknes: 3 oz on all layers
Minimum hole diameter: 0.30mm
Technical feature:impedance control
