Project Description

  • Copper foil aluminum base pcb

Copper foil aluminum base pcb

Hitech copper foil aluminum base pcb is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin and single resin as the insulating bonding layer, which can improve the performance, quality in manufacturing, manufacturing level, manufacturing cost, reliability and stability of printed circuit board.

Technical Parameters

  • Copper based printed circuit board
  • Base Material: Copper material
  • Layers: 1
  • Thickness: 3mm
  • Copper thickness: 1 Oz
  • plating process: Immersion gold
  • Description: Power LED MCPCB
  • Countersink holes+Countersink solt routing

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Product Name : Copper foil aluminum base pcb
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