Printed Circuit Board (PCB) Assembly
- Fully Automated Screen Printers with 2-D vision.
- Inline 3-D Solder Paste Inspection (SPI).
- Fully Automated Pick and Place Equipment capable of placing 01005 chip components and micro-BGA’s.
- Automated Optical Inspection (AOI) is performed on all surface mount components.
- Off line programming and quick change feeders allow for the utmost efficiency and flexibility in job change over.
- 3-D X-Ray for BGA and QFN components.
- Quick-change feeders for job flexibility.
- Dedicated lead and lead-free Selective Solder and Wave Solder equipment.
