PCB prototyping assembly and clone service

///PCB prototyping assembly and clone service

PCB prototyping assembly and clone service

Technical description

PCB prototyping assembly and clone service

  • Material: FR4 TG135
  • Layer/Thickness: 2L/1.60mm
  • Outer Copper:1/1 OZ
  • Surface treatment: Immersion siliver
  • Min. Hole Size:0.30mm
  • Min. Line Width:0.30mm
  • Min. Line Spacing:10mile
  • Technical featuer: rigid
  • Application field: automotive electronics usb