PCB prototyping assembly and clone service

• Material: FR4 TG135
• Layer/Thickness: 2L/1.60mm
• Outer Copper:1/1 OZ
• Surface treatment: Immersion siliver
• Min. Hole Size:0.30mm
• Min. Line Width:0.30mm
• Min. Line Spacing:10mile
• Technical featuer: rigid
• Application field: automotive electronics usb