High Density Interconnect PCBEvery year it will hold the PCB meeting in the world. People discuss PCB problems in this meeting. PCB makes life better. This is a practical technical session designed to teach how to shorten the High Density Interconnect PCB layout design cycle and how to apply HDI design manufacturing capabilities to a constraint-driven printed circuit board manufacturer. It will explain which processes and features cost most for HDI designs. Also shown will be examples of BGA breakouts (0.8 to 0.25mm).

This session will look at the expected reliability from stacked via technology. It will review IPC-6016 and discuss where it will fall short for HDI PCBs. It also will cover required process controls for manufacturing with laser-drilled microvias. The presenter is Amit Bahl. Atar Mittal has been a Director and General Manager at Hitech Circuits since 2003. He is responsible for PCB design and development of strategies and automated tools for high density interconnect PCBs. Prior to Hitech Circuits, Mr. Mittal held senior executive level positions in R&D and technical marketing departments in computer hardware and software services companies in the USA and India. For over 25 years he has been instrumental in developing automated design engineering & management processes and tools using the latest information technologies.