flex-rigid pcb fabrication pcba assembly bluetooth pcb

///flex-rigid pcb fabrication pcba assembly bluetooth pcb

flex-rigid pcb fabrication pcba assembly bluetooth pcb

Technical description

  • Production type:  flex-rigid pcb
  • Material: FR4 HighTG & PI
  • Application filed: Communication equipment
  • Layer/thickness: 4L/1.2mm
  • Surface treatment: Gold plating
  • Line space/width: 3/3mil
  • Minimum hole diameter: 0.3mm
  • Technical feature: flex-rigid PCB
  • flex-rigid pcb fabrication pcba assembly bluetooth pcb