Technical description
- Type: Double-sided flexible printed circuit board
- Materials: PI/0.5-mil and ADH/0.5oz Cu (RA)
- 0.5oz Cu/0.5-mil, ADH/0.5-mil,
- Cover lay: 0.5-mil PI/1 mil ADH
- Stiffener: PI
- Thickness: 0.11mm
- Surface treatment: ENIG
- Au: 0.02 to 0.1um
- Ni: 3 to 5um
- RoHS requirement
- 100% electrical tested
