Technical description

  • Type: Double-sided flexible printed circuit board
  • Materials: PI/0.5-mil and ADH/0.5oz Cu (RA)
  • 0.5oz Cu/0.5-mil, ADH/0.5-mil,
  • Cover lay: 0.5-mil PI/1 mil ADH
  • Stiffener: PI
  • Thickness: 0.11mm
  • Surface treatment: ENIG
  • Au: 0.02 to 0.1um
  • Ni: 3 to 5um
  • RoHS requirement
  • 100% electrical tested