General Information About Ceramic Printed Circuit board

Ceramic Printed circuit board (Ceramic PCB) includes Alumina (Al2O3) PCB, Aluminum Nitride (AIN)  PCB with high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, so Ceramic PCB will be your best choice.

Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.

  • 96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)
  • Conductors material: For thin, thick film technology, it’ll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it’ll be copper only
  • Application temp: -55~850C
  • Thermal conductivity value: 20W~51W/m-K (Al2O3); 120W~220W/m-K for AIN , 220~250W/m-K for BeO;
  • Max compression strength: >7,000 N/cm2
  • Breakdown Voltage (KV/mm): 15/20/28 for 25mm/0.63mm/1.0mm respectively
  • Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)

Our Ceramic PCB capability:

Type Capability
Material ”
AL203 ceramic (thickness in more than 2.0mm, need to be customized)” 0.25mm 114*114mm
0.38mm 130*140mm
0.5mm 130*140mm
0.635mm 130*140mm
0.8mm 130*109mm
1.0mm 130*140mm
1.2mm 130*109mm
1.5mm 127*127mm
2.0mm 130*140mm
Above is regular size,and other sizes can be customized, the maximum size we can do is 300*300mm

ALN Ceramic (thickness in above 1.0mm, need to be customized)” 0.25mm 50.8*50.8mm
0.38mm 114*114mm
0.5mm 114*114mm
0.635mm 114*114mm
1.0mm 300*300mm
Thermal Conductivity AL203 Ceramic AL2O3:20~51(W/mK)
ALN Ceramic AIN:120~220(W/mK)
Finished Copper Thickness Copper thickness 18/35/70um
Hole Hole size 0.075mm-30mm
Surface Finish ROHS Immersion Silver, ENIG, ENEPIG
Conductor Characteristic Copper – Cu
Min. Line width and spacing Inner layers: 50um/50um
External layers 50um/50um
Profiling Maximum Board Dimension 300*300mm/pcs