Ceramic Circuit Board Alumina Aluminum Nitride PCB

Ceramic Substrate Heat Sink High Thermal Conductivity Chip Bracket AlN Thick Gold

  1. Substrate: Aluminum Nitride board;

Thermal Conductivity: 170W/(m·K);

  1. Conductor Layer Structure: Ti/Cu/Ni/Au, whose thickness are 0.1μm, 50μm, 3μm, 1.0μm.
  2. The product is widely used in electronic packaging with stable performance and reliable quality.

We can customize all kinds of ceramic printed circuit board, various sizes, various shapes,

various substrate (aluminum nitride, alumina, monocrystalline silicon), various line spaces and various proceeds (Electroplating, MEMS, Thick film, Printing). Please do not hesitate to contact us freely, if you have any requirments or questions.