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Printed Circuit Board (PCB) Assembly

Printed Circuit Board (PCB) Assembly Fully Automated Screen Printers with 2-D vision. Inline 3-D Solder Paste Inspection (SPI). Fully Automated Pick and Place Equipment capable of placing 01005 chip components and micro-BGA’s. Automated Optical Inspection (AOI) is performed on all surface mount components. Off line programming and quick change feeders allow for the utmost efficiency and flexibility in job change over. 3-D X-Ray for BGA and QFN components. Quick-change feeders for job flexibility. Dedicated lead and lead-free Selective Solder and Wave Solder equipment.

High Density Interconnect PCB

High Density Interconnects pcb (HDI pcb) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market
segments. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit
boards (PCB).
They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

admin 2019-01-14T20:56:57+00:00 Categories: PCB Products|Tags: HDI PCB manufacturer, High density interconnect pcb, High density PCB|

10 Layers high density pcb for Industry control

10 Layers high density pcb for Industry control Details: 10 layers HDI PCB Structure: 2+6+2 with stagger via Material: FR4 Tg170（Halogen free material) Thickness: 1.6mm Surface finished: Immersion Gold Blind via L1-2 & L2-3 & L8-9 & L9-10: 0.1mm(4mil) Buried via L4-8: 0.2mm(8mil) Impedance control: differential 90 & 100ohm Minimum trace/space: 0.1/0.1mm Green LPI solder mask White legend mark