10L High Density Interconnect pcb

///10L High Density Interconnect pcb

10L High Density Interconnect pcb

Technical description

  • 10L High Density Interconnect board
  • Laminate: FR4, Tg150
  • Board thickness: 1.6mm
  • Copper thickness: 17.5um (Hoz) for all layers
  • Solder resist: green color
  • Surface Finish: Immersion gold
  • Trace width/width: 0.89/0.1mm
  • Min. holes:0.1mm
  • Controlled Impedance
  • Board stack up: 1+1+6+1+1
  • Application: Industry control