View Larger Image 10L every layer interconnection(ELIC) HDI PCB Technical description Layer count: 10 layer Board thickness:0.80mm Raw material:FR4 370HR Min.line width/space:0.075/0.075mm Minimum hole diameter:0.10mm Surface finishing:ENIG Plug via-in-pad by resin and plate flat newloong2019-03-12T12:14:33+00:00Categories: High Density Interconnect PCB, PCB Products|Tags: High density interconnect pcb, High Density Interconnection PCB, High density PCB, High density Printed circuit board| Inquiry about the product or service: Your Name (required) : Your Email (required) : Your Phone (required) : Product Quantity: Company Name (required) : Address: Description: × Share This Story, Choose Your Platform! FacebookTwitterLinkedInRedditGoogle+TumblrPinterestVkEmail