10L every layer interconnection(ELIC) HDI PCB

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10L every layer interconnection(ELIC) HDI PCB

Technical description

Layer count: 10 layer
Board thickness：0.80mm
Raw material：FR4 370HR
Min.line width/space：0.075/0.075mm
Minimum hole diameter：0.10mm
Surface finishing：ENIG
Plug via-in-pad by resin and plate flat

newloong 2018-05-27T07:41:37+00:00 Categories: High Density Interconnect PCB, PCB Products|Tags: High density interconnect pcb, High Density Interconnection PCB, High density PCB, High density Printed circuit board|