10L every layer interconnection(ELIC) HDI PCB

///10L every layer interconnection(ELIC) HDI PCB

10L every layer interconnection(ELIC) HDI PCB

Technical description

  • Layer count:  10 layer
  • Board thickness:0.80mm
  • Raw material:FR4 370HR
  • Min.line width/space:0.075/0.075mm
  • Minimum hole diameter:0.10mm
  • Surface finishing:ENIG
  • Plug via-in-pad by resin and plate flat