Technical description

  • 10L multilayer printed wiring board
  • Technical description
  • Material: FR-4 Tg170
  • Board thickness: 1.6mm
  • Surface finished: Immersion gold+Controlled Impedance
  • Copper thickness: H Oz for all layers
  • Min.line width/space: 3.5mil
  • Min through hole: 0.2mm
  • Communications